新型无铅钎料的优化设计  

Optimal design of new lead-free solder

作　　者：贺优优[1] 路林[1] 刘长军[1] 李晓光[1] 张链 

机构地区：[1]沈阳工业大学化工装备学院,辽宁辽阳111003 [2]辽阳石油化纤工程有限公司,辽宁辽阳111003

出　　处：《电焊机》2011年第2期58-61,共4页Electric Welding Machine

摘　　要：利用正交设计得出27组试验钎料配方,并测试了钎料的熔化温度、润湿性和搭接接头强度。选取熔化温度、润湿面积、抗剪强度的试验数据作为参数,根据回归设计理论,通过计算机辅助计算建立起关于五个合金元素(Cu、Ag、Sb、Bi、Re)与性能指标之间的函数方程,即二次回归方程。在满足回归方程的基础上,依据最优化原理,通过计算机编程求出钎料的最优配方及相应的最优性能。27 groups of experimental formula were disigned by orthogonal design ,and the melting temperature ,wettability,strength of lap joins of the lead-free solder were tested.According to the theory of orthogonal design and using above-mentioned data as parameters,we established the quadratic regression equation of five alloying elemental（Cu ,Ag,Sb,Bi,Re）and performance index by computer aided design.On the base of regression equation and principle of optimality that comes to a conclusion of optimum formulation and performance of lead-free solder by computer.

关 键 词：无铅钎料 润湿性 熔化温度 优化设计 

分 类 号：TG425[金属学及工艺—焊接]