Ku波段宽带固态功率放大器  

A Study of Wide Frequency Ku-band High-power Solid-state Amplifier

作　　者：蔡昱[1] 冯鹤[1] 曹海勇[1] 

机构地区：[1]南京电子器件研究所微波与毫米波专用模块电路研发部,南京210016

出　　处：《电子与封装》2011年第2期30-33,共4页Electronics & Packaging

摘　　要：近年来,随着科学技术的发展,功率合成技术发展迅猛,多种合成方案被提出来,有微带线合成、波导腔合成、辐射线合成等等,但都有各自的优势和不足。文章介绍了一种Ku波段宽带固态功率合成放大器的工程实现。固放采用多芯片多级合成,根据工程应用的实际要求,每级合成采用了不同的合成方式。文章所研究合成功率放大器的基本单元模块由两个功率芯片通过Lange桥合成,在装入壳体合成之前单独调试,确保功率和相位基本一致后再用波导合成器进行功率合成。最后通过8路E面波导功分器将9W模块的功率合成在Ku波段宽带范围内大于60W的功率输出,测试数据和模拟数据基本吻合。Recently,power-combining technology has been developed rapidly.Various combining architectures have been reported such as microstrip combiner,waveguide combiner,and radial power combiner.In this paper,an engineering application of a wide frequency Ku-band SSPA（Solid-State Power Amplifier） is presented.Multi-chips combining technique is adopted in the design of SSPA.To meet the engineering request of the product,different combining structures have been used on different levels.The 9W modules are combined by two power MMICs using Lange bridge combiner,which has been measured independently before assembled to insure that modules have equivalent power output and phase.Finally,output power of over 60W in the Ku band is obtained though the 8-way waveguide combiner.The measured results are found to be in good agreement with the simulation data.

关 键 词：固态功率放大器 Lange桥 MMIC 波导功分器 

分 类 号：TN72[电子电信—电路与系统]