微系统集成大面积智能化衬底技术研究  

A Technology of Large area Intelligent Substrates in Integrated Microsystems

作　　者：汤玉生[1] 凌行[1] 戴庆元[1] 沈志广[1] 

机构地区：[1]上海交通大学微电子技术研究所,上海200030

出　　处：《微细加工技术》1999年第3期49-53,共5页Microfabrication Technology

摘　　要：智能化衬底技术既是集成微系统的载体，也是微系统集成的手段。采用真空盒吸片技术开发了一种实用的智能化衬底技术工艺方法。真空盒吸片技术解决了芯片的初始定位（对准装片）及芯片位置和共平面性的保持，确保了可用 Ｉ Ｃ工艺完成芯片间的互联。并使工艺的加工面积不受限制，且可达圆片尺度。因此，该智能化衬底技术工艺方法具有很强的实用性和很好的可靠性。Intelligent substrate is not only a carrier, but also a method in integrated microsystems. An usable technology of large area intelligent substrate has been developed by using a vacuum box drawing technique.The technique can support the aligned mounting of chips and remain chip's position and coplanarity between the mounted chips and the substrate, which guarantees the realization of interconnecting embedded chips by use of IC technology. Thetechnique also makes the area of an intelligent substrate not to be limited and it can be up to wafer size. Therefore. the technology developed in this paper has strong availability and high reliability.

关 键 词：微系统 智能化衬底 真空盒吸片技术 IC MIC 

分 类 号：TN405[电子电信—微电子学与固体电子学]