BGA元器件受热模型分析与SMT工艺控制  

Thermal model analysis and SMT process control of BGA components

作　　者：王亚盛[1] 

机构地区：[1]威海职业学院,山东威海264210

出　　处：《电子元件与材料》2011年第4期56-58,共3页Electronic Components And Materials

摘　　要：不同BGA封装结构的元器件在回流焊过程中,由于其焊球的受热路径和热阻不同,导致焊球受热不均匀、PCB变形甚至引起IC芯片的＂虚接触＂,严重影响BGA元器件的焊接质量。通过对BGA封装元器件受热模型、热阻的分析,提出了不同BGA封装结构的元器件回流焊温度设置和控制要点：PBGA元器件峰值温度在235～245℃时焊接时间10～15 s最佳,CBGA元器件在峰值温度在235～245℃时焊接时间15～20 s最佳。There were different solder ball heating pathes and thermal resistances of components of different BGA packaging structure in the reflow process,it caused that solder balls was being heated unevenly and PCB deformation as well as ＂virtual contact＂ of IC chips,these defects seriously affected the quality of soldering.Through the analysis of BGA packaging components thermal model and the thermal resistance,different BGA package components reflow temperature settings and control points are proposed,the effects are best with peak temperature in 235-245 ℃ for 10-15 s for PBGA components and peak temperature in 235-245 ℃ for 15-20 s for CBGA components.

关 键 词：BGA元器件 SMT工艺 热阻 回流焊 

分 类 号：TN306[电子电信—物理电子学]