“Im-Sn+热处理”涂层工艺研究  

Study of "Im-Sn+Heat Treatment" Finish Technology

作　　者：曾福林[1] 邱华盛[1] 刘哲[1] 樊融融[1] 

机构地区：[1]中兴通讯股份有限公司,广东深圳518057

出　　处：《电子工艺技术》2011年第2期76-79,89,共5页Electronics Process Technology

摘　　要：现代电子产品应用和生产中抗恶劣环境的侵蚀能力和贮存过程中可焊性的保持,一直是存在于电子产品应用和生产中的极其重要的问题。寻求一种能较好地同时满足上述要求的表面镀层工艺,国内外均在研究中。介绍了一种经过长时间的全面可靠性和工艺适应性试验后,筛选出来的"Im-Sn+热处理"涂层工艺所表现出的优良的抗环境侵蚀能力和储存中良好的可焊性保持能力。并探讨和分析了形成这种能力的机理。Anti-erosion ability in electronic product application and harsh production environment and solderability during Storage are important problems in electronic product application and production.A surface finish which can meet all above requirements at the same time has been looked for in the world.An ＂Im-Sn＋ heat treatment＂ finish Technology is Introduced based on the tests of long time reliability and process adaptability.The finish Technology provides good anti-erosion ability in harsh environment and solderability during Storage.The formation mechanism of the ability and the solderability are discussed.

关 键 词：涂层 Im-Sn 无铅焊接 虚焊 

分 类 号：TN60[电子电信—电路与系统]