压电微能量采集器PZT厚膜制备及其图形化研究  

Preparation and micro-patterning of bulk PZT thick films for piezoelectric micropower harvester

作　　者：唐刚[1,2] 刘景全[1] 杨春生[1] 柳和生[1,3] 李以贵[1] 

机构地区：[1]上海交通大学微纳科学技术研究院微米/纳米加工技术国家级重点实验室薄膜与微细技术教育部重点实验室,上海200240 [2]南昌工程学院机械与电气学院,江西南昌330099 [3]南昌大学机电工程学院,江西南昌330031

出　　处：《真空》2011年第2期19-21,共3页Vacuum

基　　金：科技部国际合作项目(2009DFB10330);上海市国际科技合作基金(08230705500);国家自然科学基金(60876082);新世纪优秀人才支持计划(2009);江西省科技厅对外科技合作项目(No.2010EHAO2500)

摘　　要：采用环氧树脂作为中间层的真空键合技术实现体材PZT与硅片键合,再利用机械化学抛光方法将PZT减薄到适当的厚度制备了PZT铁电厚膜,构成了SiO2/Si/SiO2/Epoxy/Ag/PZT/Cr/Cu形式的压电能量采集器悬臂梁结构。基于半导体光刻技术,通过湿法化学刻蚀和切片两种方法实现了PZT厚膜图形化问题,为基于体材PZT厚膜的高性能压电能量采集器的研制打下了良好的基础。Bulk PZT thick films for piezoelectric micropower harvester were prepared through bonding the bulk PZT to silicon wafer in vacuum with the epoxy resins used as intermediate adhesive layer,then the PZT piece was thinned down and lapped to a suitable thickness to prepare the ferroelectic PZT thick films,thus providing a cantilever structure of piezoelectric micropower harvester made from SiO2/Si/SiO2/Epoxy/Ag/PZT/Cr/Cu.Based on the semiconducting lithography,the micro patterning of PZT thick films was implemented via the wet chemical etching technique and dicing method.A firm foundation was therefore laid down for the research and development of piezoelectric micropower harvester with high performance.

关 键 词：压电能量采集器 真空键合 PZT(锆钛酸铅)厚膜 湿法化学刻蚀 振动 

分 类 号：TN305[电子电信—物理电子学]