陶瓷球栅阵列封装的三维有限元分析  

Three-dimensional finite element analysis of ceramic ball grid array package

作　　者：王直欢[1] 

机构地区：[1]上海海事大学集装箱供应链技术教育部工程研究中心,上海201306

出　　处：《上海海事大学学报》2011年第1期60-64,共5页Journal of Shanghai Maritime University

基　　金：国家重点基础研究发展计划("九七三"计划)资助项目(5131201);上海市科学技术委员会资助项目(09DZ2250400);上海市教育委员会重点学科建设项目(J50604)

摘　　要：为有效准确地模拟和预测陶瓷球栅阵列(Ceramic Ball Grid Array,CBGA)在复杂热载荷下的失效问题,建立一种整体与局部相结合的CBGA三维有限元分析方法.该方法主要由4部分组成:预测复合焊点三维结构;计算其等效焊点几何参数以及材料属性;用等效焊点替换真实复合焊点并预测最危险焊点位置;用真实焊点模型替换最危险位置的等效焊点,再进行总体分析得到真实焊点中最危险点的位置.采用MSC Patran对XILINX公司生产的FF1152进行有限元建模,并通过Marc分析其复合焊点在0～100℃热循环下的应力应变以及塑性能量密度.分析结果可确定最危险焊点以及该焊点中最容易失效的位置,与许多已有的实验结果相一致.In order to simulate and predict the failure of Ceramic Ball Grid Array（CBGA） under complex thermal load effectively and accurately,a three-dimensional finite element analytical method of CBGA which combines the whole and the local is developed.The method consists of predicting three-dimensional structure of composite solder joint,calculating geometric parameters and material properties of its equivalent solder joint,replacing real composite solder joint with equivalent solder joint and predicting location of the most dangerous solder joint,replacing the most dangerous equivalent solder joint with real solder joint model and obtaining the most dangerous position in real solder joint by general analysis.A finite element model of FF1152 produced by XILINX is built by Patran.The stress,strain and plastic energy density of its composite solder joint under thermal cycle from 0℃ to 100℃ are analyzed by Marc.The result determines the most dangerous solder joint and the most vulnerable position in the solder joint,which is in accordance with many previous experimental results.

关 键 词：有限元建模 陶瓷球栅阵列 封装 焊点 热失效 

分 类 号：TN405[电子电信—微电子学与固体电子学] TB115[理学—数学]