集成电路陶瓷外壳封盖振筛电镀技术研究  

Research on the Vibratory Sieve Electroplating Technique for the Cover of IC Ceromic Package

作　　者：许维源[1] 马金娣[1] 沈卓身[2] 侯进 

机构地区：[1]中国科学院电子学研究所,北京100080 [2]北京科技大学,北京100083 [3]邯郸大舜电镀设备总厂,邯郸056106

出　　处：《电镀与精饰》1999年第6期6-7,30,共3页Plating & Finishing

摘　　要：集成电路陶瓷外壳封盖用盖板为６ ｍ ｍ ×９ ｍ ｍ ×０．１ ｍ ｍ 的可伐片（Ｆｅ－Ｃｏ－Ｎｉ合金），由于盖板薄而轻，用普通滚镀机电镀易变形粘连且镀层厚度极不均匀，成品率不到５０％ 。采用新型振筛式电镀机电镀并采用双脉冲电镀技术，镀层厚度偏差小于１０％ ，成品率达到９０％ 以上，这项电镀技术可广泛用于超小型零件电镀。Kovar (Fe 29Ni 17Co alloy) plate of 6 mm×9 mm×0 1 mm is used for the cover of IC ceramic package. When using conventional barrel plating, it is easy to deform and adhere from its light weight and thin thickness, cansing uneven plating thickness and the rate of qualified products less than 50%. A new vibratory sieve type of electroplating technique with double pulse electroplating in this research makes plating thickness deviation of the cover be less than 10% and the rate of qualified products be over 90%. This technique can be used in electroplating of small size workpieces.

关 键 词：集成电路 外壳 盖板 振动电镀 电镀 

分 类 号：TN405.8[电子电信—微电子学与固体电子学]