硅微粉表面改性对覆铜板耐热性影响的研究  

Effect of Silica Powder Surface Modification on CCL's Thermal Stability

作　　者：黄晨光[1] 黄伟壮[1] 

机构地区：[1]广东生益科技股份有限公司,广东东莞523039

出　　处：《绝缘材料》2011年第2期59-62,共4页Insulating Materials

摘　　要：对硅微粉的表面改性进行了表征,用不同类型和不同使用量的偶联剂对硅微粉进行表面改性后将其应用在覆铜板中,通过对比样品的耐热性能优选出合适的偶联剂种类和用量。结果表明,以硅微粉重量1%的环氧型Z-6040偶联剂处理后,活性硅微粉可以显著地改善板料的耐热性。The surface modification of a kind of silica powder filler was characterized.Various types and amount of coupling agents were used to modify the silica powder filler that was then applied in copper clad laminate.Comparison was made on the thermal stabilities of different samples to select optimized type and amount of coupling agent.The results show that addition of an active silica powder modified by epoxy type Z-6040 coupling agent and 1% of silica powder in copper clad laminate can significantly improve its thermal stability.

关 键 词：硅微粉 偶联剂 覆铜板 耐热性 

分 类 号：TM215[一般工业技术—材料科学与工程]