Sagging phenomenon observed in micro-solder joints fabricated by laser reflow soldering process  

作　　者：LIU Wei WANG Chun-qing TIAN Yan-hong KONG Ling-chao 

机构地区：[1]State Key Lab of Advanced Welding Production Technology, Department of Electronics Packaging Technology, Harbin Institute of Technology, Harbin 150001, China

出　　处：《材料科学与工程（中英文版）》2008年第4期37-42,共6页Journal of Materials Science and Engineering

基　　金：Acknowledgements： The work is supported by National Natural Science Foundation of China （No. 50675047） and Samsung Semiconductor （China） R ＆ D Co., Ltd. The authors would like to thank Professor LI Ming-yu in Shenzhen Graduate School, Harbin Institute of Technology, and Dr. DING Ying, in Microjoining Lab, Schoo） of Materials Science and Engineering, Harbin Institute of Technology for their comments.

关 键 词：工艺制造 回流焊接 下垂 激光 金属间化合物 焊点 冷却速度 焊料 

分 类 号：TN405[电子电信—微电子学与固体电子学] TB657.2[一般工业技术—制冷工程]