颗粒锡膜形貌与氧压及基片温度的相关性  

Influence of Oxygen Pressure and Substrate Temperature on the Morphology of Tin Granular Films

作　　者：成照宇[1] 刘向东[1] 

机构地区：[1]华中科技大学材料科学与工程学院,武汉430074

出　　处：《材料导报》2011年第12期103-105,共3页Materials Reports

基　　金：国家自然科学基金资助项目(10774052)

摘　　要：利用电阻式真空蒸镀系统制备出了颗粒锡膜,并通过场发射电子显微镜(FSEM)对其生长进行了表征。研究发现,锡膜的表面形貌与氧压及基片温度强烈相关。随着氧压升高,锡膜颗粒粒径减小,形状趋于规则;随着基片温度升高,锡膜颗粒趋于规则,粒径先增后减。就颗粒锡膜的连通性及气敏性进行了初步研究,成膜后高温退火有助于提高颗粒锡膜的连通性,200℃工作环境下膜对氧气具有相当高的气敏性。Granular tin films were prepared by conventional vacuum deposition technique. Field emission scan ning micrography（FSEM） had been used to characterize surface morphology of granular tin films grown on mica sub- strate. It is found that the surface morphology of granular tin films is strongly dependent on the oxygen pressure and the substrate temperature. As oxygen pressure raises, the grain size of tin granules decreases, while the shape becomes regular;with increasing substrate temperature, the grain size of tin granules increases up to a certain value and then declines, and the shape becomes regular. Preliminary investigation on the continuity and gas-sensing property of granular tin films had been done. The continuity of granular tin films becomes better by high temperature annealing after deposition. At 200 ℃, granular tin film has a relatively good gas-sensitivities of oxygen.

关 键 词：真空沉积 颗粒锡膜 FSEM 气敏性 

分 类 号：O484.1[理学—固体物理]