利用PⅢ技术改变框架与EMC间附着力的研究  

Study on the Adhesion Strength Between Epoxy Molding Compound and Leadframes Modified by PⅢ Technology

作　　者：刘立龙[1] 张昕[1] 卢茜[1] 周乾飞[1] 吴晓京[1] 

机构地区：[1]复旦大学材料科学系,上海200433

出　　处：《半导体技术》2011年第6期434-438,共5页Semiconductor Technology

基　　金：国家科技重大专项(2009ZX02025)

摘　　要：利用等离子体浸没式注入(PⅢ)技术,使用O2,N2,CO和CO2做气体源,对镀镍铜框架表面进行处理。拉力测试实验结果表明,与未经处理的空白框架相比,经过CO和CO2等离子体注入处理的镀镍铜框架与环氧塑封料(EMC)间的附着力分别提高了约35倍和12倍,而在使用O2和N2等离子体注入处理的情况下,附着力基本没有变化。通过扫描电子显微镜(SEM)对处理前后的框架表面观察,发现PⅢ处理并未引起表面粗糙度的显著变化。利用X射线电子能谱(XPS)分析,可以发现在经过CO或CO2等离子体注入处理后的框架表面有羰基出现。基于这些结果,分析了导致附着力提升的机理。Using O2,N2,CO and CO2 as the source gases,the Cu leadframes pre-plated with nickel were modified by plasma immersion ion implantation（PⅢ） technique.The pull test shows that comparing with leadframes without treatment,the adhesion strength between the leadframe and epoxy molding compound（EMC） increases about 35 and 12 times after CO and CO2 plasma implantation,respectively.While after O2 and N2 plasma implantation,the adhesion strength does not change at all.The scanning electron microscope（SEM） was used to observe the morphology of the leadframe surface.It is found that the surface roughness does not change seriously after PIII treatment.X-ray photoelectron spectroscopy（XPS） analysis shows that after CO or CO2 plasma implantation,the carbonyl appeares on leadframes surface.Based on these analysis results,the mechanism of adhesion enhancement was discussed.

关 键 词：镀镍铜框架 环氧塑封料 等离子体浸没式注入 附着力 羰基 

分 类 号：TN305.94[电子电信—物理电子学]