水平与垂直流动对微电铸镀层均匀性的影响  

Influence of horizontal and vertical flow pattern on coating uniformity inside micro-structures during electrodeposition

作　　者：陈晖[1] 汪红[1] 李光杨[1] 姚锦元[1] 王艳[1] 丁桂甫[1] 

机构地区：[1]上海交通大学微纳科学技术研究院微米/纳米加工技术国家重点实验室薄膜与微细技术教育部重点实验室,上海200240

出　　处：《传感器与微系统》2011年第6期20-23,共4页Transducer and Microsystem Technologies

基　　金：上海市科委科研计划资助项目(0852nm02600);国家重点实验室基金资助项目(9140C79030302090C79)

摘　　要：利用有限元分析软件FLUENT对微电铸镀层均匀性进行了分析。对当物质传递成为金属沉积的控制步骤时,进行铸层均匀性的数值模拟,研究不同流动方式对均匀性的影响。模拟结果表明:当物质传递成为控制步骤时,增强对流—扩散虽然有利于物质传输,但均匀搅拌更有利于镀层均匀性;垂直流动相对于水平流动因离子到达阴极表面各处的传质阻力相同,故能有效改善镀层形貌的均匀性。Micro-electroforming uniformity is analyzed using FLUENT software.Effects of different flow pattern on uniformity is studied.It is simulated when the mass transfer turns into the control step.The results of simulations show that when the uniformity is controlled mainly by mass transfer,though enhancing convection-diffusion is conducive to the mass transfer,mixing is more beneficial to the coating uniformity.Relative to the horizontal flow,vertical flow can effectively improve coating uniformity due to the same mass transfer resistance.

关 键 词：微电铸 对流—扩散传质 传质阻力 流动方式 

分 类 号：TQ153[化学工程—电化学工业]