Au-Al双金属键合可靠性分析  

Reliability Analysis of Au-Al Bimetallic Bonding

作　　者：程春红[1] 许洋[1] 刘红兵[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《半导体技术》2011年第7期562-565,共4页Semiconductor Technology

摘　　要：键合是半导体器件生产过程中的关键工序,对器件的产品合格率和长期使用的可靠性影响很大。在半导体器件中Au-Al键合系统的失效现象屡有发生,但又不可避免的使用,因此Au-Al双金属键合的可靠性备受人们的关注。通过分析Au-Al双金属键合的失效机理,提出了Au-Al双金属键合的正确设计方法及工艺控制措施,给出了多个批次多个品种的Au-Al双金属键合的实际使用结果。研究表明,只要设计正确,采用有效的工艺控制措施,在结温150℃以下使用,采用Au-Al双金属的器件仍然可以应用在高可靠场所。Bonding is the key process in the semiconductor device production,it influences qualified rate and long term reliability largely.The invalidation of Au-Al bimetallic bonding often occur but can＇t help being used in semiconductor devices,therefore,the reliability of Au-Al bimetallic bonding is taken attention.Through the analysis of failure mechanism of Au-Al bimetallic bonding, correct design methods and process controlling means are presented,many effective results of Au-Al bimetallic bonding applied in devices and circuits are exhibited.The results show that the Au-Al bimetallic bonding deviceused below junction temperature of 150 ℃ can be applied at high reliable conditions as long as designed correctly and taken process controlling means.

关 键 词：关键工序 合格率 Au-Al键合 失效机理 结温 

分 类 号：TN305.93[电子电信—物理电子学] TN406