CMOS兼容的微机械热电堆红外探测器阵列研究  

Study of CMOS compatible micromachined thermopile infra-red detector array

作　　者：徐德辉[1,2] 熊斌[1] 王跃林[1] 

机构地区：[1]中国科学院上海微系统与信息技术研究所传感技术国家重点实验室,微系统技术重点实验室,上海200050 [2]中国科学院研究生院,北京100039

出　　处：《浙江大学学报（工学版）》2011年第6期1043-1047,1107,共6页Journal of Zhejiang University：Engineering Science

摘　　要：通过设计2种不同微机械热电堆红外探测器阵列结构,对微机械热电堆红外探测器阵列性能进行研究.阵列器件采用二维的面阵列结构,单元探测器分别以串联和并联2种方式分别组成阵列,微机械热电堆的热电偶材料采用N型多晶硅和铝,结构支撑膜为氧化硅-氮化硅-氧化硅复合介质膜,悬浮绝热结构通过前端XeF2干法各向同性硅腐蚀工艺制作.采用XeF2干法工艺对器件进行最终释放,器件成品率得到了很大的提高;热电堆的材料及制造工艺都与标准CMOS技术完全兼容,降低了器件的制作成本,并且能够适用于器件的批量生产.试验结果表明:并联方式的阵列可以实现红外探测并行扫描的功能,串联的阵列则可以进一步提高红外探测器的输出电压及探测率,但不能提高器件的响应率.Two 2×2 parallel-connected and series-connected micromachined thermopile infra-red（IR） detector arrays were designed and fabricated.The N-poly/Al thermocouples were placed on a floating SiO2-Si3N4-SiO2 dielectric membrane,which was released by XeF2 front-side dry isotropic etching.Since XeF2 dry etching process was used for the thermopile structure release,the fabrication yield is enhanced;because both the material and process are fully compatible with CMOS technology,the fabrication cost is reduced and the fabricated detector arrays also have the potential for mass production.For the two-dimensional parallel-connected thermopile IR detector array,the experimental results show that the parallel-connected structure can be used for scanningarea IR detection.For the series-connected thermopile IR detector array,the experimental results show that the series-connected structure can improve the detector＇s output voltage and specific detectivity,but without the improvement of responsivity.

关 键 词：微机械热电堆 红外探测器 探测器阵列 CMOS兼容 

分 类 号：TN379[电子电信—物理电子学] TN403