复配表面活性剂对无铅助焊剂润湿性能影响的研究  

Effect of the surfactants in flux on wettability of lead-free solder

作　　者：郑家春[1] 杨晓军[1] 雷永平[1] 夏志东[1] 郭福[1] 

机构地区：[1]北京工业大学材料科学与工程学院,北京100124

出　　处：《电焊机》2011年第7期79-84,共6页Electric Welding Machine

基　　金："十一五"国家科技支撑重点资助项目"含有毒有害材料元素材料替代技术"(2006BAE03B02)

摘　　要：助焊剂中的表面活性剂对于降低熔融无铅钎料的表面张力,增加无铅钎料对母材的润湿性具有重要作用。根据表面活性剂的HLB值和分子量,选取了四种不同类型的表面活性剂。以无水乙醇作溶剂,有机酸作活性剂,加入所选表面活性剂,并添加成膜剂、缓蚀剂等其他成分,配制成助焊剂,用于研究表面活性剂对无铅钎料润湿性能的影响。润湿力测试及铺展实验结果表明,助焊剂中表面活性剂的种类和含量对无铅钎料的润湿性能影响较明显,选用适宜的表面活性剂复配体系可以进一步提高助焊剂性能。Surfactant plays a great role in reducing the surface tension of the melting lead-free solder and increasing the wettability of the lead-free solder on base metal.Four different types of surfactants were selected in accordance with HLB values and molecular weights.The flux used for the study of the effect of surfactants on wettability of lead-free solder was composed of anhydrous ethanol as solvent,organic acids as active moiety,selected surfactants,and some other components such as film formers,corrosion inhibitor,etc.The results of the wetting power tests and spread tests showed that the types and contents of surfactants in flux had a rather obvious influence on the wettability of lead-free solder.It was found that the flux with properly combined surfactants had improved properties.

关 键 词：表面活性剂 无铅钎料 助焊剂 润湿性能 

分 类 号：TG422[金属学及工艺—焊接]