BGA装配工艺与技术  

BGA Assembly Process and Technology

作　　者：董义[1] 

机构地区：[1]中物院电子工程研究所,四川绵阳621900

出　　处：《新技术新工艺》2011年第7期10-12,共3页New Technology & New Process

摘　　要：总结了BGA装配的特点,从BGA的封装形式、装配前预烘烤、贴片、再流焊接工艺等方面,分析了BGA组装过程中应注意的问题及其预防措施。重点分析了传统的SnPb组装和无铅组装工艺特点,提出了无铅BGA混合装配的工艺解决方案。Assembly points of BGA were summarized.Questions and measures during BGA assembly were analyzed to increase BGA assembly quality by BGA package,advance roasting,place BGA,and reflow welding process.Traditional SnPb assembly process and lead free assembly process were analyzed,and the process solution to mixed mounting of lead free BGA was put forward.

关 键 词：BGA 无铅 再流焊接 温度曲线 

分 类 号：TN705[电子电信—电路与系统]