X射线照相发现的管壳缺陷分析  

Analysis of Package Defect Found in X-Ray Inspection

作　　者：程春红[1] 潘茹[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《半导体技术》2011年第8期643-645,650,共4页Semiconductor Technology

摘　　要：现在对半导体器件的可靠性要求越来越高,因此对器件的质量检测提出了严格的要求,为了能准确检测器件质量是否合格,使用X射线检测技术对器件进行无损检测。X射线对缺陷损伤做快速精确探测分析具有方便、直观等优点。对一例不常见的X射线照相检查发现的晶体管空洞缺陷进行了分析、试验,确定空洞是由管壳存在的问题引起的,提出了解决空洞问题的措施。说明了器件在筛选时进行X射线照相检查的必要性,可以将有缺陷的器件早期剔除,以保证器件的可靠性。There is higher and higher requirement for reliability of semiconductor devices,thus,the strict demands for quality of devices are presented.In order to test the quality of devices precisely,nondestructive testing is needed by Xray.It is quickly and accurately by X-ray to detect and analyse defect damage.An abnormal transistor void defect found in X-ray inspection was analyzed,determining that it comed from package itself,and the means to solve problem was presented.The X-ray inspection becomes a necessary means during screening,and some devices with defects can be eliminated early to assure the reliability of devices.

关 键 词：可靠性 无损检测 缺陷 X射线 空洞 

分 类 号：TN307[电子电信—物理电子学]