InGaAs近红外探测器高可靠封装技术  

High reliability packaging technology of InGaAs near IR detector

作　　者：刘大福[1,2] 杨力怡[1,2] 徐勤飞[1,2] 吴家荣[1,2] 洪斯敏[1,2] 沈一璋[1,2] 

机构地区：[1]中国科学院上海技术物理研究所传感技术国家重点实验室,上海200083 [2]中国科学院红外成像材料与器件重点实验室,上海200083

出　　处：《红外与激光工程》2011年第8期1412-1415,共4页Infrared and Laser Engineering

基　　金：国家自然科学基金重点项目(50632060);中国科学院知识创新工程资助课题(C2-50)

摘　　要：对256元和512元InGaAs线列探测器进行了气密封装,对封装结构和工艺中的几个关键技术进行了分析,包括热电致冷器的热负载性能、温度烘烤性能、组件密封性。研究结果表明:在室温条件下,热电致冷器的致冷温差可以达到55 K以上,热负载每增加50 mW,致冷温差下降约0.51 K,能够满足组件的使用要求。经过120℃、500 h的烘烤后,热电致冷器仍能保持性能不变。组件的密封性达到了国军标的要求。Both 256×1 and 512×1 element linear near IR lnGaAs focal plane array （FPA） modules were hermetically packaged. Some key technologies in packaging structure and process were analyzed, including the heat load performance, high temperature baking performance and sealed package leak rate of the thermoelectric cooler （TEC）. The results show that the cooling temperature difference of the TEC can reach above 55 K at room temperature. It drops about 0.51 K when heat load increases 50 roW. It means that the TEC can meets the modules requirements. After a baked test at 120 ℃ with 500 h, the performances of the TEC never change. The sealed package leak rate of the modules meets in the national military standard .

关 键 词：INGAAS 气密性 热电致冷器 密封 平行缝焊 

分 类 号：TN215[电子电信—物理电子学]