BGA芯片的返修与锡球重整  

The reworking and planting-ball of BGA

作　　者：倪宏俊 

机构地区：[1]中船重工集团公司武汉七○九所质量处,湖北武汉430030

出　　处：《印制电路信息》2011年第9期65-67,共3页Printed Circuit Information

摘　　要：详细介绍了BGA芯片的返修与植球的流程和工艺。This article particular recommends that the BGA assembling is a new technology in modem electronic assembly work. High quality BGA repair increases the up to standard rate of product and reduces the cost of component. This paper introduces the concept of BGA assembling work, the technology of repairing the BGA component and planting-ball.

关 键 词：球栅阵列 温度曲线 返修 植球 

分 类 号：TD98[矿业工程—选矿]