一种LQFP64引线框架封装的优化设计  

An Improved 64-lead Low-profile Quad Flat Package

作　　者：孙海燕[1] 孙玲[1] 

机构地区：[1]南通大学专用集成电路设计重点实验室,江苏南通226019

出　　处：《电子与封装》2011年第9期1-4,共4页Electronics & Packaging

基　　金：核高基重大专项分课题(2009ZX01031-002-002-002);国家自然科学基金项目(61040032);江苏省自然科学基金项目(BK2009153);江苏省教育厅高校科研成果产业化推进项目(JHZD10-036)

摘　　要：工艺简单、成本低廉是引线框架封装的优点,但引线框架的固定结构限制了其应用带宽。文中利用HFSS软件完成了一种标准的LQFP64引线框架的优化建模和S参数仿真。结果表明,该LQFP64优化模型以较低的封装成本提高了射频/微波集成电路的封装带宽,其回波损耗S31在4.7GHz为-1dB、插入损耗S11在4.9GHz为-15dB、串扰S21在2.7GHz为-15dB,较标准模型分别提高了34%、58%和69%。Simple process and low cost are the two major advantages of lead frame package, but the application bandwidth has been limited by its fixed structure. Based on a standard 64-lead low-profile quad flat package, HFSS was used to create optimized package model and simulate for S parameters. The simulation results show that the optimized model has extended the RFIC/MMIC package bandwidth to higher frequencies at lower cost. The bandwidth measured for insertion loss （S31） , return loss （S11） , and coupling （S21） is 4.7GHz （at -1dB） , 4.9GHz （at -15dB） , and 2.7GHz （at -15dB） . Compared with the standard LQFP64 package, we find that the bandwidth of S31, S11, and S21 is increased 34%, 58%, and 69% respectively.

关 键 词：集成电路封装 LQFP 电磁建模 寄生效应 

分 类 号：TN305.94[电子电信—物理电子学]