敷铜PCB走线与过孔的电流承载能力  

Current Capacity of Trace and VIA for PCB with CCL

作　　者：赵艳雯 陆坚[2] 

机构地区：[1]上海联合汽车电子有限公司,上海201206 [2]中国电子科技集团公司第58研究所,江苏无锡214035

出　　处：《电子与封装》2011年第9期11-14,22,共5页Electronics & Packaging

摘　　要：使用FR4敷铜板PCBA上各个器件之间的电气连接是通过其各层敷着的铜箔走线和过孔来实现的。由于不同产品、不同模块电流大小不同,为实现各个功能,设计人员需要知道所设计的走线和过孔能否承载相应的电流,以实现产品的功能,防止过流时产品烧毁。文中介绍设计和测试FR4敷铜板上走线和过孔的电流承载能力的方案和测试结果,其测试结果可以为设计人员在今后的设计中提供一定的借鉴,使PCB设计更合理、更符合电流要求。Through copper traces and VIAs on PCBA with FR4 CCL （Copper Clad Laminate） , the components on it could be interconnected. There are different size currents for different modules and different products to make every function to work, so layout engineers need to know which width for the trace or which size for the VIA. It can make sure that the product can work normally, even if over current happens, the product will not burn out. This document will introduce the test of current capacity of trace and VIA for CCL PCB and the result of the test. The result of test could give layout engineer some references to make PCB design more reasonable and fitting the current requirements.

关 键 词：电流承载能力 走线 镀通孔 

分 类 号：TN306[电子电信—物理电子学]