Sn-9Zn/Cu焊点剪切强度及断口形貌分析  

Sn-9Zn/Cu Solder Joints Shear Strength and Fracture Morphology Analysis

作　　者：孙静[1] 孟工戈[1] 陈永生[1] 

机构地区：[1]哈尔滨理工大学材料科学与工程学院,黑龙江哈尔滨150040

出　　处：《电子工艺技术》2011年第5期262-264,276,共4页Electronics Process Technology

摘　　要：研究了BGA直径分别为750μm、1 000μm、1 300μm的Sn-9Zn/Cu焊点剪切强度及其变化规律。采用SEM和EDX对剪切断口进行观察和元素成分分析。试验结果表明,随着焊球直径的增大,焊点剪切强度先减小后增大。剪切断裂位置大部分位于钎料内部,局部位于界面化合物Cu5Zn8处。在相同的剪切高度与剪切速率下,随着焊点直径的增加,断裂形式依次为韧性断裂、脆性断裂、韧脆混合断裂和抛物线型韧窝变浅。The shear strength and changing regularity of Sn-9Zn BGA solder joints are studied,BGA diameters are 750 μm,1 000μm,1300μm.SEM and EDX are used to observe the shear fractures and element component.The results show that,Sn-9Zn/Cu solder joints shear strength first decreases and then increased with the increase of solder ball diameter.The fracture positions of Solder joints are most located in solders,and partially in the interface compounds Cu5Zn8 after welding.In the same shear height and shear rate,with the increase of the diameter of solder joint,the fracture mode is in order as ductile fracture,brittle fracture and ductile-brittle mixed fracture;The parabolic dimples become shallow.

关 键 词：SN-9ZN 剪切强度 IMC 剪切断口 

分 类 号：TN604[电子电信—电路与系统]