光清洗技术在雷达微组装方面的应用  

Application of UV Cleaning Technology In Radar Microelectronic Assembly

作　　者：林伟成[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230031

出　　处：《电子工艺技术》2011年第5期277-279,284,共4页Electronics Process Technology

摘　　要：在生产雷达微电子组件时,由于各种原因,会在组件当中留下人体残留的油脂、头皮屑、焊膏的残留物和松香焊剂残留物等,这些多余物不仅可能对组件造成腐蚀,还会引起电路短路和电气误动,影响金丝键合的附着力,这些多余物不清洗干净将严重影响雷达微电子组件的长期工作寿命和使用可靠性。雷达微电子组件由于采用高度精密的微组装技术,显得既复杂又娇贵,一般的清洗技术如超声波清洗已经无法满足雷达微电子组件高精密清洗的要求。光清洗技术由于对组件损伤小和清洁程度高,是对雷达微电子组件清洗的有效方法之一。介绍了光清洗技术的基本原理、优点和主要的工艺控制参数,预见光清洗技术必将在雷达微组装方面发挥越来越重要的作用。During the manufacturing of radar microelectronic modules,grease and dandruff of human body,residues of solder paste and rosin flux will be left in them.These superabundant substances not only erode these modules,but also result in short circuit,electric misacting and bad adhesion of wire bonding.If these superabundant substances don’t be removed from modules,they will greatly influence their reliability and long term working life.These modules are complex and delicate due to adopting high precision microelectronic assembly technology during the manufacture of radar microelectronic modules.Common cleaning technology such as ultrasonic cleaning can’t satisfy the requirement of high precision cleaning of these modules.UV cleaning damnify modules very slightly,has high degree cleanness,so it is a very valid way to clean radar microelectronic modules.Introduce the basic mechanism,strong points,main process parameters of UV cleaning technology,and

关 键 词：光清洗 精密清洗 雷达 微电子组件 可靠性 

分 类 号：TN605[电子电信—电路与系统]