南瓜脆片微波干燥工艺研究  

Study on the Microwave Drying Technique of Pumpkin Crisp Chip

作　　者：熊涛[1,2] 龙娇[2] 

机构地区：[1]长江大学长江中游湿地农业教育部工程研究中心,湖北荆州434025 [2]长江大学生命科学学院,湖北荆州434025

出　　处：《安徽农业科学》2011年第26期16437-16440,共4页Journal of Anhui Agricultural Sciences

基　　金：长江大学博士启动基金项目(0364);湖北省教育厅青年项目(Q200712005);湖北省科技厅项目(2008CDB384)

摘　　要：[目的]研究南瓜脆片微波干燥的方法。[方法]对微波功率、切片厚度、处理时间和预处理后南瓜片初始含水率等因素对膨化干燥南瓜脆片的影响进行研究和比较。[结果]在微波功率为中高火,南瓜片的切片厚度为3 mm,预处理后南瓜片初始含水率为18%左右的条件下,可得到高品质的南瓜脆片,干燥390 s时膨化率高达220%。[结论]微波干燥很适合南瓜脆片的制作。[Objective] To study the microwave drying method of pumpkin crisp chip.[Method] The effects of microwave power,slice thickness,treatment time and water content in pumpkin chip after pretreatment on the puffed drying of pumpkin crisp chip were studied and compared.[Result] High-quality pumpkin crisp chip could be produced by setting the microwave power at medium-high heat,the slice thickness at 3mm and the water content in pumpkin chip after pretreatment at 18%,the puffing rate could reach as high as 220% after 390 s drying.[Conclusion] Microwave drying was a good technique to produce pumpkin crisp chip.

关 键 词：南瓜片 微波 膨化干燥 

分 类 号：S852.16[农业科学—基础兽医学]