导热型无胶单面挠性覆铜板的研究  

Study on thermal conductive two layers single-sided FCCL

作　　者：周韶鸿[1] 谢飞[1] 陈耀[1] 沈文彬[1] 黄州 王德荣[1] 

机构地区：[1]广东生益科技股份有限公司,广东523039

出　　处：《覆铜板资讯》2011年第5期20-24,共5页Copper Clad Laminate Information

摘　　要：以氮化硼、氧化铝为导热填料,采用涂布法制备导热型二层法单面挠性覆铜板。考察了导热填料对板材剥离强度、尺寸稳定性、卷曲性、机械性能及热导率的影响,并通过扫描电镜分析导热填料的分散效果。By using boron nitride and alumina as thermal conductive filler, the thermal conductive two layers single-sided flexible copper clad laminate （FCCL） was prepared by casting. The effect of thermal conductive filler on peel strength, dimensional stability, curvature, mechanical properties and thermal conductivity of two layers single-sided FCCL was investigated. The dispersion of thermal conductive filler was analyzed by scanning electron microscope.

关 键 词：挠性覆铜板 导热填料 性能 热导率 

分 类 号：TQ174.1[化学工程—陶瓷工业]