低银SnAgCuBiNi无铅钎料润湿及溶解行为分析  

Analysis on wettability and dissolution behavior of low Ag SnAgCuBiNi lead-free solder alloys

作　　者：万忠华[1] 卫国强[1] 师磊[1] 张宇鹏[2] 

机构地区：[1]华南理工大学机械与汽车工程学院,广州510640 [2]广州有色金属研究院焊接材料研究所,广州510651

出　　处：《焊接学报》2011年第10期89-92,117,共4页Transactions of The China Welding Institution

基　　金：国家自然科学基金-广东省联合基金资助项目(U0734006);广东省科技厅计划处基金资助项(2008A080403008-06);天河区科技计划项目(095G108)

摘　　要：对Sn0.8Ag0.5Cu2.0Bi0.05Ni(SACBN)和Sn3.0Ag0.5Cu(SAC305)无铅钎料的显微组织、润湿性能和溶解行为进行了比较研究.结果表明,SACBN钎料显微组织由β-Sn+共晶体组成,共晶组织为在β-Sn基体上均匀分布细针状的Ag3Sn、粒状的(Cu,Ni)6Sn5和细小粒状的铋.在相同温度条件下,SACBN钎料的润湿角大于SAC305钎料,铺展面积小于SAC305钎料,但SACBN钎料的最大润湿力却大于SAC305钎料,润湿时间小于SAC305钎料.随着时间的增加,铜在两种钎料中的溶解量均呈线性增加,在250,275℃时铜在SACBN钎料中的溶解速率低于SAC305钎料;在300℃时,铜在SACBN钎料中的溶解速率高于SAC305钎料.The microstructure,the wettability and dissolution behavior of Sn0.8Ag0.5Cu2.0Bi0.05Ni(SACBN) and Sn3.0Ag0.5Cu(SAC305) lead-free solder alloys were comparatively investigated.The results show that the microstructure of SACBN solder alloy contains β-Sn and eutectic phase,and that the eutectic phase is composed of β-Sn,well-distributed needlelike Ag3Sn,granular(Cu,Ni)6Sn5 and minor granular Bi.The max wetting force of SACBN was higher,and the wetting time was shorter than SAC305 while the wetting angle was bigger and the spreading area was smaller with same temperature.The dissolution quantity of Cu substrate linearly increases with increasing immersion time in the two solder alloys.The dissolution rate of SACBN solder alloy is lower than SAC305 at 250 ℃ and 275 ℃,and is higher at 300 ℃.

关 键 词：无铅钎料 润湿性 溶解速率 显微组织 

分 类 号：TG115.28[金属学及工艺—物理冶金]