LED封装技术在光电工程实践教学中的应用  

Application of LED packaging technology in the opto-electronic engineering practice teaching

作　　者：闻春敖[1] 郑晓东[1] 刘向东[1] 刘玉玲[1] 

机构地区：[1]浙江大学光电信息工程学系,杭州310027

出　　处：《光学技术》2008年第S1期289-291,共3页Optical Technique

摘　　要：实践教学在高等学校工程教学中越来越受到重视。如何在实践教学的实际内容中体现出研究性、创新性和反映最新行业需求是众多教育工作者所关心的问题。发光二极管是人们在日常生活中常用的光电器件之一。把LED芯片封装到最终产品的整个过程作为光电信息专业学生实践教学内容的建设方针、实施方案及考核方式。实施结果表明,该实践教学内容具有成本低、趣味性强、与专业知识点联系紧密等特点,具有广泛的推广价值。Practice teaching is getting more and more attention in colleges and universities engineering teaching.How to embody the research-oriented,innovation and requirements from the latest industry in the practice teaching is concerned by many educators.LED is one of optoelectronic devices in our daily life.The construction policy,implementing scheme and evaluation mode of the practice teaching for the students majored in optoelectronic information,are introduced based on the whole process from LED chip packaging to final LED products.The result of implementation shows that this practice teaching is worthy to be widely spread with its low cost,strong interest and close association with the specialized knowledge and real life.

关 键 词：工程教育 实践教学 LED封装 实习 工艺流程 

分 类 号：TN20-4[电子电信—物理电子学] TN305.94