电弧离子镀制备CrN_x薄膜中熔滴的结构表征与形成机制  

Formation Mechanisms and Microstructures of Droplets in CrN_x Film Deposition

作　　者：陈康敏[1] 郑陈超[1] 张晓柠[1] 黄燕[1] 关庆丰[1] 宫磊[2] 孙超[2] 

机构地区：[1]江苏大学材料科学与工程学院,镇江212013 [2]中国科学院金属研究所材料表面工程研究部,沈阳110016

出　　处：《真空科学与技术学报》2011年第6期681-685,共5页Chinese Journal of Vacuum Science and Technology

基　　金：江苏大学科技创新团队课题和江苏大学高级人才基金(07JDG032)资助

摘　　要：应用电弧离子镀技术,在不同的氮气分压(0.5~2.5 Pa)和脉冲偏压(0^-300 V)条件下对TC4基体沉积CrNx薄膜,采用扫描电镜和透射电镜对镀膜过程中产生的熔滴现象进行分析研究。结果表明,升高氮气分压能减少靶材排出粒子团数量,改变等离子体轰击作用,从而控制熔滴数量及尺寸,改善薄膜表面平整度;脉冲偏压能够使熔滴与薄膜紧密结合,改变熔滴成分,在一定范围内能促进靶材成分熔滴的形成。The CrNx films were deposited by pulsed bias arc ion plating on Ti-6Al-4V substrates.The impacts of the deposition conditions on formation of droplets on the CrNx film surfaces were evaluated.The microstructures of the droplets were characterized with X-ray diffraction,scanning electron microscopy（SEM）,and transmission electron microscopy（TEM）.The results show that the nitrogen partial pressure and pulsed bias strongly affect the formation and numbers of the droplets.For instance,an increase of nitrogen partial pressure results in less particle emission from the targets,reduction of surface bombardment,enhancement of particle ionization,and improvement of film growth;consequently less and smaller droplets form.Besides,the pulsed bias of the substrates inversely affects the formation and growth of the droplets,and favorably induces inter-diffusion and interaction between the droplets and the films.

关 键 词：电弧离子镀 CRNX薄膜 熔滴 扫描电镜 透射电镜 

分 类 号：TB43[一般工业技术]