低银Sn-Ag-Cu无铅钎料的发展现状及发展趋势  

Development status and development trend of low-silver Sn-Ag-Cu lead-free solder

作　　者：张群超[1] 张富文[1] 胡强[1] 

机构地区：[1]北京有色金属研究总院有色金属加工事业部,100088

出　　处：《焊接》2011年第11期28-31,71,共4页Welding & Joining

基　　金：国家创新团队863课题(2009AA033901)

摘　　要：开发低银无铅钎料是目前电子钎料行业的迫切需求。目前主要开发了Sn-0.3Ag-0.7Cu和Sn-1.0Ag-0.5Cu等低银钎料,与原有钎料相比,低银钎料具有成本低、耐冲击性能好等优点,但是也存在熔点高、强度低等缺点。目前研究集中在Sn-0.3Ag-0.7Cu和Sn-1.0Ag-0.5Cu基础上添加Ni,Mn,Ti,Zn,Bi,RE等元素以改善其性能。随着原材料价格的继续上涨,无银、低锡电子钎料或成为电子钎料的发展方向。The exploration of low-silver lead-free solder is of magnificent importance for electronic solder industry. Now,people have mainly developed Sn-0. 3Ag-0. 7Cu and Sn-l.0Ag-0.5Cu etc. Low-silver lead-free solder is cheap and more shock resistant,but its melting point is higher, its wettability is poor. Currently, the work focuses on the addition of some elements such as Ni, Mn, Ti, Zn, Bi, RE to improve its properties. In the future,with the price of the raw materials rising,low Sn,non-silver electronic solders may become the developing orientation.

关 键 词：无铅钎料 低银 性能 趋势 

分 类 号：TG425.1[金属学及工艺—焊接]