RFID芯片超声倒装封装技术研究  

RFID Die Packaging by Ultrasonic Flip-chip Technology

作　　者：张加波[1,2] 安兵[1,2] 孙亚男[1,2] 蒋青青[1,2] 吴懿平[1,2] 

机构地区：[1]武汉光电国家实验室,湖北武汉430074 [2]华中科技大学连接与电子封装中心,湖北武汉430074

出　　处：《电子工艺技术》2011年第6期326-329,共4页Electronics Process Technology

基　　金：国家自然科学基金项目(项目编号:60876070;60976076)

摘　　要：超声倒装是近年来芯片封装领域中快速发展的一种倒装技术,具有连接强度高、接触电阻低、可靠性高、低温下短时完成和成本低的优势,特别适合较少凸点的RFID芯片封装。在镀Ni/Au铜基板上进行了RFID芯片超声倒装焊接实验,金凸点与镀Ni/Au铜基板之间实现了冶金结合,获得了良好的力学与电气性能,满足射频要求。Ultrasonic flip chip packaging is a rapidly developing technology for die bonding in the recent years.It has the advantages of high bonding strength,low contact resistance,high reliability,low cost,low-temperature and short-time process,and is especially suitable to the RFID die packaging with small bumps.The RFID die is bonded on the nickel-gold-plated copper substrate by the ultrasonic flip-chip welding.The metallurgical bonding is achieved between the gold bumps and the nickel-gold substrate,which offer a good mechanical and electrical performance,and satisfy the requirement of the radio frequency.

关 键 词：射频识别 芯片封装 超声倒装 冶金结合 

分 类 号：TN60[电子电信—电路与系统]