微量Co对第二代低银SAC焊料合金改性机理研究  

Study of Modified Mechanism on Doping a Little Cobalt among Second Generation Lead-free Low-Ag SAC Solder Alloy

作　　者：樊融融[1] 刘哲[1] 邱华盛[1] 伊藤学 森公章 入泽淳 

机构地区：[1]中兴通讯,广东深圳518057 [2]Koki株式会社

出　　处：《电子工艺技术》2011年第6期330-334,356,共6页Electronics Process Technology

摘　　要：目前电子制造业界把低成本的低Ag无铅焊料合金定义为第二代无铅焊料合金。在目前已公开的第二代无铅低Ag焊料合金类型中,又以掺入微量Co改性的应用性能和可靠性表现最优秀而受到了关注。重点对该类型焊料合金掺Co改性的机理展开了研究试验。在研究试验结论的基础上,分析了其推广应用的良好前景。At present,lead-free low-Ag solder alloy,which is low-cost,is defined as the second generation of lead-free solder alloy in the electronics manufacturing industry.Among the second generation of lead-free low-Ag solder alloy type,the solder alloy doping a Little cobalt is paid wide attention because it shows the best performance and reliability.Focuses on the type of the doping cobalt solder alloy and make a study of the mechanism which advance the performance.On the basis of the conclusion of researched test the type solder has a good prospect of wide application.

关 键 词：无铅焊料 低Ag合金 掺Co改性 SMT 

分 类 号：TN605[电子电信—电路与系统]