基于Icepak的功率芯片散热结构热阻计算  

Calculation of Thermal Resistance of Heat Sink for Power IC Based on Icepak

作　　者：周元[1] 冯雯雯[1] 向敏[1] 

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060

出　　处：《微电子学》2011年第6期897-900,905,共5页Microelectronics

摘　　要：介绍了混合电路中功率芯片典型散热结构及其热阻的数学计算方法,以及运用Icepak热仿真软件对散热结构建模并对其热阻进行计算的过程。对计算结果进行了验证,并运用仿真软件建模求解的方式,得到各典型散热结构的热阻数据。Typical heat sinks for power chip in hybrid integrated circuits were described.Method for calculating its thermal resistance was presented.Modeling of heat sink and calculation of thermal resistance using thermal simulation software Icepak were discussed in detail.Calculation results were validated.Thermal resistance data for typical heat sinks were obtained by using thermal simulation modeling method.

关 键 词：功率芯片 散热结构 热阻 电子设计自动化 

分 类 号：TN402[电子电信—微电子学与固体电子学]