Pyrex7740玻璃通孔湿法腐蚀技术研究  

Fabrication of Via-hole on Pyrex7740 Glass Wafer by HF Wet-etching Technique

作　　者：张锦文[1] 杨化冰[1,2] 蒋巍[1] 王龙[1] 

机构地区：[1]北京大学微电子学研究院微米/纳米加工技术国家级重点实验室,北京100871 [2]北京大学软件与微电子学院,北京102600

出　　处：《功能材料与器件学报》2011年第6期596-599,共4页Journal of Functional Materials and Devices

摘　　要：本文研究报道了Pyrex7740玻璃湿法腐蚀通孔技术。将四寸硅玻璃键合圆片的玻璃衬底减薄,并在玻璃上分别制备PECVD SiC、W/Au和PECVD多晶硅三种不同掩膜及其开口,最终利用40%HF腐蚀实现玻璃通孔。整个工艺过程与IC工艺兼容,并可进行圆片级批量加工。观察并研究纵向和横向腐蚀过程和通孔形貌,对比三种不同腐蚀掩膜掩蔽效果。本文研究结果为圆片级密封封装及其它MEMS器件奠定了基础。This paper reports fabrication of via - hole on Pyrex7740 glass wafer by wet - etching technique. Firstly silicon and glass wafers were anodically bonded together and glass wafer was thinned to about 1007 m. Then three kinds of materials （such as PECVD SiC and Poly - Si and W/Au） were prepared and patterned as hard - mask respectively. Lastly via - holes were realized by 40% HF wet - etching on glass wafer. This process is very simple, low price and IC compatible. The vertical and lateral etching processes were studied and profile of the via - hole was observed. The masking impact of three kinds of hard - masks was compared. This work can be useful for the fabrication of some MEMS device, especially wafer- level vacuum package.

关 键 词：Pyrex7740玻璃 湿法腐蚀 深宽比 腐蚀掩膜 

分 类 号：TN305.7[电子电信—物理电子学]