积层绝缘树脂沾污去除和化学镀铜工艺  

Build-up isolation resin used in Desmear and Electroless copper plating process

作　　者：蔡积庆（译） 

机构地区：[1]江苏南京,210018

出　　处：《印制电路信息》2012年第2期26-30,共5页Printed Circuit Information

摘　　要：概述了积层绝缘树脂用的去沾污和化学镀铜工艺,可以制造高速信号传输,微细线路和高可靠性的下一代半导体封装基板。This paper describes build-up isolation resin used desmear and electroless copper plating process,which can manufacturing next generation semiconductor packaging substrate having high speed signal transmission,fine line and high reliability.

关 键 词：积层绝缘树脂 中和 整平剂 化学镀铜 半加成法 去沾污 

分 类 号：TN41[电子电信—微电子学与固体电子学]