一种低成本专用混合微电路封装技术  

A Cheap Specific Hybrid Microcircuit Packaging Technology

作　　者：王万一 

机构地区：[1]华东光电集成器件研究所,江苏苏州215163

出　　处：《电子与封装》2012年第2期6-8,共3页Electronics & Packaging

摘　　要：随着半导体技术的发展,无论是对产品的技术指标、长期可靠性还是其成本,选择合适的封装技术显得极其重要。文章介绍了一种混合微电路硅胶滴注封装工艺,它具有美观、成本低、可返工的特点,同时又能适应震动、高温等恶劣环境,还能满足中等功率电路的散热需求。With the development of semiconductor technology, whether it is the product of technical indicators, or the cost of long-term reliability, choose the appropriate packaging technology seems extremely important. This pape describes a hybrid mircrocircuit silica gel instill package process,it boasts of characteristics as nice outlook, lost cost. rework capability, while suitable for vibration, temperature and other harsh environment, but also to meet the cooling demand for medium-power circuits.

关 键 词：封装 滴注 

分 类 号：TN305.94[电子电信—物理电子学]