LTCC基板金丝热超声楔焊正交试验分析  

Analysis of Orthogonal Test for Thermo-sonic Wedge Bonding on LTCC Circuit Board

作　　者：金家富[1] 胡骏[1] 

机构地区：[1]中国电子科技集团公司第38研究所,安徽合肥230088

出　　处：《电子与封装》2012年第2期9-11,25,共4页Electronics & Packaging

摘　　要：引线键合是微组装技术中的关键工艺,广泛应用于军品和民品芯片的封装。特殊类型基板的引线键合失效问题是键合工艺研究的重要方向。低温共烧陶瓷(LTCC)电路基板在微波多芯片组件中使用广泛,相对于电镀纯金基板,该基板上金焊盘楔形键合强度对于参数设置非常敏感。文章进行了LTCC基板上金丝热超声楔焊的正交试验,在热台温度、劈刀安装长度等条件不变的情况下,分别设置第一键合点和第二键合点的超声功率、超声时间和键合力三因素水平,试验结果表明第一点超声功率和第二点超声时间对键合强度影响明显。The wire bonding technique, which is the key technology of micro-assembly, is widely used in chip packaging of military and civil products, wire bonding failures of specific circuit board is the major direction of the bonding technology research. Low temperature co-fired ceramics （LTCC） is widely used in microwave multi-chip module, which is sensitive for bonding parameters in wedge bonding strength, compared with pure gold plated board. The orthogonal test for thermo-sonic wedge bonding on LTCC circuit board is discussed in this article. Ultrasonic power, ultrasonic time and bonding force are given for the first bond and the second bond by holding the temperature of heater and length of capillary. Ultrasonic power for first bond and ultrasonic time for second bond are effective for wire bonding strength.

关 键 词：正交试验 金丝 热超声楔焊 

分 类 号：TN305[电子电信—物理电子学]