微喷口阵列的TMAH“两步法”制备工艺  

Investigation of TMAH for Fabricating Micro Nozzle Array

作　　者：余协正[1] 叶迎华[1] 沈瑞琪[1] 

机构地区：[1]南京理工大学应用化学系,南京210094

出　　处：《传感技术学报》2012年第2期184-187,共4页Chinese Journal of Sensors and Actuators

基　　金：航天科技创新基金项目(CASC201105)

摘　　要：为了高效经济地实现单晶硅喷口阵列的批量加工,通过大量实验,研究了TMAH溶液在不同浓度、温度、刻蚀时间以及添加剂过硫酸铵的添加量和添加方式等对单晶硅刻蚀结果的影响规律,得到了"两步法"的优化刻蚀工艺:第1步在低浓度、高温度下进行高速刻蚀;第2步降低刻蚀温度,同时添加过硫酸铵,进行表面修饰,降低粗糙度。该工艺具有操作简便、经济高效的特点,结合该工艺已成功制备出高质量的固体化学微推进器喷口阵列。In order to achieve an efficient and economical batch process of silicon nozzle array,by carrying out numerous experiments,this paper studied the TMAH（Tetramethyl Ammonium Hydroxide）solution at different concentrations,temperature,etching time and the addition of the AP（Ammonium Persulfate） and its adding process on the results of etching,obtained an optimized ＂two-step＂ etching process.The first step is etching in low concentration,at high temperature with a high etching rate;the second step is to lower the etching temperature and add AP,and thus surface roughness can be modified.This process is simple with better economic benefit,which has been successfully used to produce a high quality nozzle array of solid propellant micro thruster.

关 键 词：MEMS 微喷口阵列 各向异性刻蚀 TMAH 过硫酸铵 粗糙度 

分 类 号：TN304.052[电子电信—物理电子学]