硅抛光片(CMP)市场和技术现状  

Market and Technical Status of Polished Silicon Wafer

作　　者：张志坚[1] 张凡[1] 邱光文[1] 彭茂公[1] 王红鹰[1] 俞琨[1] 

机构地区：[1]昆明冶研新材料股份有限公司,云南昆明650031

出　　处：《云南冶金》2012年第1期40-44,共5页Yunnan Metallurgy

摘　　要：介绍了硅抛光片在硅材料产业中的定位和市场情况,化学机械抛光(CMP)技术的特点,硅抛光片大尺寸化技术问题和发展趋势,以及硅抛光片技术指标,清洗工艺组合情况等。The following situations are introduced in this paper： the orientation and market situation of polished silicon wafer in silicon material industry, the features of chemical mechanical polishing （CMP） technology, technical problems of large size polished silicon wafer and its development trend, as wall as the technical index of polished silicon wafer, cleaning process combination etc.

关 键 词：硅抛光片 CMP技术 清洗 

分 类 号：TN304.12[电子电信—物理电子学]