电镀锡和可焊性锡合金发展概况  

Review of tin and solderable tin alloy electroplating

作　　者：庄瑞舫[1] 

机构地区：[1]南京大学配位化学研究所,江苏南京210093

出　　处：《电镀与涂饰》2000年第2期38-43,共6页Electroplating & Finishing

摘　　要：锡及其合金由于优良的耐蚀性和可焊性而广泛应用于电子工业中。总结了电镀锡、锡铅合金和锡铋合金的分类、特点及应用情况。Tin and its alloy electroplating have been widely adopted in electronic industry for their excellent corrosion resistance and solderability. The classification, characteristics, and application results of tin, tin lead and tin bismuth electroplating were summarized.

关 键 词：可焊性 电镀 锡合金 锡铅合金 锡铋合金 

分 类 号：TQ153.13[化学工程—电化学工业] TQ153.2