SMT焊点间隙和贴片误差自调整作用分析  

Analysis of Stand-off Height and Self alignment Effects of Solder Joint in SMT

作　　者：王国忠[1] 程兆年[1] 王春青[2] 钱乙余[2] 

机构地区：[1]中科院上海冶金研究所,上海200050 [2]哈尔滨工业大学

出　　处：《焊接学报》2000年第1期71-74,共4页Transactions of The China Welding Institution

摘　　要：采用表面组装SnPb焊点形态的势能控制方程 ,对片式元件RC32 16的三维焊点形态进行了数值模拟。基于焊点体系的势能数据 ,分析了片式元件的焊点间隙和贴片误差的自调整作用。结果表明 ,焊点间隙随焊点钎料量的增加而近似线性增加 ;焊点间隙和焊点钎料量的增加有助于贴片误差的自调整作用 ,并提出了焊点间隙的一种回归模型。By employing the potential energy controlling equation for SnPb solder joint formation in surface mount technology,the 3D solder joint geometry were numerically simulated.Based on the calculated potential energy data for the solder joint system,the stand off height and the self alignment effects for misaligned placement were investigated.The results show that the stand off height increases near linearly with the increase of solder volume.The increases of stand off height and solder volume can enhance the self alignment of chip component.Moreover,a regression model for stand off height was put forward.

关 键 词：表面组装 片式元件 焊点形态 间隙 自调整 钎焊 

分 类 号：TG454[金属学及工艺—焊接]