用剥离法测量厚膜导体的附着强度  

A Method of Measuring Adhesive Strength of Thick-Film Conductor by Peal Test

作　　者：陈峤[1] 

机构地区：[1]昆明贵金属研究所,中国昆明650221

出　　处：《贵金属》2000年第1期32-34,共3页Precious Metals

摘　　要：导体面积 2mm× 2mm ,焊料成分为 62Sn/ 3 6Pb/ 2Ag,引线Φ0 8mm ,与基体表面成90°弯曲 ,拉伸速度 10mm/min。用剥离法测试 3种导体附着强度的结果表明 :该法操作程序简单、数据稳定、重现性好 ,可以检验导体的附着强度和监控生产工艺的稳定性。The adhesive strength of thick-film conductors was measured by means of peal test method.In the test,the area of the conductor is 2mm×2mm,the solder is the 62 Sn-36Pb-2Ag alloy,the leader with diameter of 0 8mm was bend to 90° with the substrate,the tensile speed is 10mm/min.The test results for 3 conductors indicate that the data obtained have high stability with good reproducibility.The method operates easity and can be used to examine the adhesive strength of conductors and to monitor the reproducibility of production process.

关 键 词：厚膜导体 附着强度 剥离法 测量 

分 类 号：TN304.055[电子电信—物理电子学]