新型抛光垫沟槽及其在化学机械抛光中的作用研究进展  

Research progresses on the new groove shapes of polishing pad and their effects on CMP processes

作　　者：方照蕊[1] 魏昕[1] 杨向东[1] 邹微波[1] 

机构地区：[1]广东工业大学机电工程学院,广州510006

出　　处：《金刚石与磨料磨具工程》2012年第2期77-81,共5页Diamond & Abrasives Engineering

基　　金：国家自然科学基金项目(No.51175092);教育部高校博士学科专项科研基金项目(No.20104420110002);广东省自然科学基金项目(No.10151009001000036)资助

摘　　要：化学机械抛光过程中,抛光垫性能是影响抛光质量和抛光效率的重要因素之一,而抛光垫的性能又受其表面沟槽结构形状的影响。在介绍几种常见抛光垫沟槽结构形状的特性及其作用研究的基础上,介绍了新型抛光垫沟槽的研究进展,总结了几种新型抛光垫沟槽对抛光效果的影响,为抛光垫沟槽特性的进一步研究提供参考。In the process of chemical mechanical polishing（ CMP）, the performance of polishing pad is one of the most important factors that affects the quality of polished surface and polishing; efficiency, which is influenced by the surface groove shape of the pad surface. In order to provide a reference for further research on the groove performances of polishing pad, the research progress on new groove structures of polishing pad was presented, and the effects of new pad groove structures on the CMP processes were summarized.

关 键 词：化学机械抛光 抛光垫 表面沟槽 

分 类 号：TG58[金属学及工艺—金属切削加工及机床]