田口试验设计在键合工艺参数优化中的应用  

Application of Taguchi Method of Bonding Technology Parameter Optimize for Packaging

作　　者：于金伟[1] 

机构地区：[1]潍坊学院机电与车辆工程学院,山东潍坊261061

出　　处：《压电与声光》2012年第4期631-635,639,共6页Piezoelectrics & Acoustooptics

基　　金：国家星火计划基金资助项目(2011GA740047);山东省国际科技合作计划基金资助项目(201013);山东省星火计划基金资助项目(2011XH06025);山东省科学技术发展计划基金资助项目(2011YD16019)

摘　　要：为提高微机电系统(MEMS)封装引线键合的可靠性和经济性,引入了镍钯金印刷电路板(PCB),但由于其保护皮膜中钯层的加入,键合工艺参数也需随之改变,该文运用试验设计(DOE)中的田口试验设计方法,找到了针对新型镍钯金皮膜的最优化键合工艺参数,根据优化结果,改进了键合工艺参数设置,成功地将镍钯金PCB应用到MEMS封装工艺中,不但提高了产品的可靠性,还降低了原材料成本,取得了良好的经济效益。NiPdAu PCB is proposed in order to improving reliability and economy of bonding of MEMS packaging. Because Pd is joined in protecting involucra, bonding technology parameter must change. In this paper, Taguchi method of DOE is used and optimized bonding technology parameter of new type NiPdAu involucra has been discov- ered. According to optimize results,mending bonding technology parameter and Ni Pd Au PCB is triumphantly used into MEMS packaging technology,not only increasing reliability of products, but also reducing cost of raw and processed materials and obtaining well economy benefit.

关 键 词：封装 键合 MEMS 田口试验设计 镍钯金PCB 

分 类 号：TN305.96[电子电信—物理电子学]