印制板微孔金属化工艺改进  

Technology Improvement for Porous Metallization of Printed Circuit Board

作　　者：杨防祖[1] 吴伟刚[1] 田中群[1] 周绍民[1] 

机构地区：[1]厦门大学化学化工学院固体表面物理化学国家重点实验室,福建厦门361005

出　　处：《电镀与精饰》2012年第8期30-33,共4页Plating & Finishing

基　　金：国家重点基础研究发展规划项目(973)(2009CB930703);国家自然科学基金项目(20873114;20833005;21021002)

摘　　要：在分布有微孔的印制板上,按照印制板孔金属化工艺路线,研究并改进印刷板孔金属化工艺;探索乙醛酸化学镀铜工艺在印制板微孔金属化中的应用,并采用扫描电子显微镜分析镀层的特点。结果表明,环保型乙醛酸化学镀铜可以成功地应用于印制板孔金属化加工工艺中。印制板孔金属化后,微孔内壁上的铜镀层紧密附着于内壁,颗粒较细小;虽然沉积铜颗粒排列相对疏松和不均匀,但能满足工艺要求。微孔外壁沉积出的化学镀铜层光亮、晶粒细小致密。The PCB porous metallization process was studied and improved according to established process route.Electroless copper plating using glyoxylic acid as reducing agent was used for the porous metallization and scanning electron microscope（SEM） was applied for analyzing characteristics of the coating.Results showed that this environmental friendly process could be applied to PCB porous metallization successfully,the copper layer had strong bonding force and fine grains.Though the copper deposition was in a little loose and uneven grain arrangement relatively,but it could meet the process requirement.

关 键 词：印制板 孔金属化 乙醛酸 化学镀铜 工艺 

分 类 号：TN705[电子电信—电路与系统]