基于COB技术的LED散热性能分析  

Thermal Performance Analysis of LED Based on the COB Technology

作　　者：祁姝琪[1] 丁申冬 秦会斌[1] 郑鹏[1] 于阳[1] 俞栋[1] 

机构地区：[1]杭州电子科技大学新型电子器件与应用研究所,杭州310018 [2]浙江古越龙山电子科技发展有限公司,浙江绍兴312000

出　　处：《电子与封装》2012年第8期36-39,共4页Electronics & Packaging

摘　　要：当前,散热问题已成为影响LED寿命、光效、光衰和色温等技术参数的重要因素。文章在综合分析散热技术和LED封装对散热性能影响的基础上,利用COB(板上芯片)封装技术,将LED芯片直接封装在铝基板上,研制成了一种基于COB封装技术的LED。与SMD封装LED进行比较,分析了其散热性能。分析结果表明:基于COB封装技术的LED减少了LED器件的结构热阻和接触热阻,使其具有良好的散热性能。The heat dispersion of LEDs has significant influence on LED＇s operation life, luminous efficiency, optical attenuation and color temperature. After the analysis of heat dissipation techniques and the effects of packaging technology on LED＇s heat performance, the COB （chip on board） packaging technology is employed in this paper to develop a LED product in which the LED chips are directly encapsulated on the aluminum plate. Its heat dispersion performance is compared with the LED based on SMD. The thermal characteristic is analyzed by thermal infrared imager. And the experimental results indicate that the structure thermal resistance and contact heat resistance of LEDs are reduced obviously when the COB （chip on board） packaging technology is utilized. And the heat dissipation performance of LEDs and uniformity of light are improved.

关 键 词：LED 散热 COB 

分 类 号：TN305.94[电子电信—物理电子学]