金刚石化学镀铜包覆及其对铜/金刚石复合材料性能的影响  

Preparation of Cu Coated Diamond Powders and Its Influence on Performance of Cu/Diamond Composite

作　　者：张毓隽[1] 蔡华春[2] 沈卓身[3] 

机构地区：[1]西安科技大学材料科学与工程学院,陕西西安710043 [2]九江职业技术学院机械工程系,江西九江332007 [3]北京科技大学材料科学与工程学院,北京100083

出　　处：《热加工工艺》2012年第18期109-112,共4页Hot Working Technology

摘　　要：采用化学镀铜法对金刚石进行表面包覆,得到了不同铜和金刚石质量比的复合粉末,再通过进行放电等离子烧结(SPS),最终得到高金刚石体积百分含量(70vol%)的铜/金刚石复合材料。结果表明:化学镀铜包覆能明显改善所得烧结体中金刚石的分布情况;该复合材料的致密度有所提高,当金刚石体积分数达到70%时,其致密度在97.5%左右,并最终使其热导率上升,最高热导率为404W/m.K。Cu coated diamond powders in variable mass ratio of diamond and Cu were prepared by electroless plating process,then the coated powders were sintered by Spark Plasma Sintering（SPS）.Cu/diamond composite with the high content of diamond（70vol%） were obtained eventually.The results indicate that not only coating diamond by copper electroless plating process can be used to obtain the well-dispersed Cu/diamond composite,but also effectively improve the relative density of the sintered body.The relative density of the sintered body with 70vol% content of diamond is about 97.5%,and the composite with higher thermal conductivity was obtained.The thermal conductivity of the composite can reach 404 W/m·K.

关 键 词：铜/金刚石复合材料 化学镀铜 热导率 致密度 

分 类 号：TB331[一般工业技术—材料科学与工程]