基于等效弹性模量的压电双晶片微夹钳夹持力检测方法  

Gripping Force Measurement Method for Piezoelectric Bimorph Micro-Grippers Based on Equivalent Elastic Modulus

作　　者：孙媛[1] 张之敬[1] 叶鑫[1] 金鑫[1] 

机构地区：[1]北京理工大学机械与车辆学院,北京100081

出　　处：《兵工自动化》2012年第10期25-28,共4页Ordnance Industry Automation

基　　金：国防基础科研项目(B22200×××××);国家自然科学基金(50875025);国家自然科学基金(51075035)

摘　　要：为保证压电双晶片微夹钳能稳定且安全无损地夹持零件,提出一种基于等效弹性模量的压电双晶片微夹钳夹持力检测方法。依据等效弹性模量理论提出夹持力计算模型,提出夹持力检测方法,通过先行实验测定所选压电双晶片的等效弹性模量等少量参数来计算夹持力,以自行研发的宏微结合压电双晶片微夹钳为对象进行夹持力检测实验。实验结果表明,该方法具有良好的夹持力检测精度。In order to grip miniature parts stably and safely by piezoelectric bimorph micro-grippers, a gripping force measurement method for piezoelectric bimorph micro-grippers based on equivalent elastic modulus is proposed. This paper establishes a gripping force calculating model according to the equivalent elastic modulus theory, proposes a measurement method in which the bimorph＇s equivalent elastic modulus is tested in pre-experiments for the gripping force calculation, and conducts gripping force measurement experiments with a self-developed coarse-fine piezoelectric bimorph micro-gripper as an object. Experiment results indicate that the method has good measurement accuracy.

关 键 词：微装配 微夹持 夹持力 等效弹性模量 压电双晶片 

分 类 号：TJ03[兵器科学与技术—兵器发射理论与技术]