PCB微盲孔电镀铜填平影响因素研究  

Research on Influence Factors of Micro Blind Via Filling Copper Plating in PCB

作　　者：秦佩[1] 陈长生[1] 

机构地区：[1]中国电子科技集团公司第十五研究所,北京100083

出　　处：《电子工艺技术》2012年第5期277-280,共4页Electronics Process Technology

摘　　要：为满足含微盲孔的高密度互连印制电路板高可靠性的要求,提出了微盲孔电镀铜填平的互连工艺技术。通过对微盲孔电镀铜填平工艺影响因素的分析,主要研究了电镀铜添加剂对微盲孔电镀铜填平的影响,运用了正交试验的分析方法,得到了各添加剂的最佳浓度范围,并验证了其可行性,从而使微盲孔获得了很好的填充效果。In order to meet the requirements of high reliability of the high-density interconnect PCB （Printed Circuit Board） with micro blind via, the interconnection technology of micro blind via copper filling has been put forward. Analyze influence factors of micro via plating, and mainly study the effect of the plating additives on micro via plating. Adopt Taguchi method to get the optimum concentration range and validate their feasibility. Finally the result of via filling was very good.

关 键 词：印制板 微盲孔 填孔 添加剂 

分 类 号：TN41[电子电信—微电子学与固体电子学]