混装电路板中通孔元器件焊接方法探索  

Through-Hole Components Soldering Method of Mixed Circuit Board

作　　者：许达荣 

机构地区：[1]重庆四联测控技术有限公司,重庆401121

出　　处：《电子工艺技术》2012年第5期285-288,296,共5页Electronics Process Technology

摘　　要：所谓混装电路板即既包含有表面贴装元器件又包含有通孔元器件的电路板。随着电子装连技术的发展,对于纯表面贴装元器件电路板或纯通孔元器件电路板的焊接组装来说,工艺已经非常成熟。但是对于混装电路板的焊接组装,方法众多,工艺较为复杂,如何选用将给出参考。通过介绍混装电路板中通孔元器件的各种焊接方法,讨论这些焊接方法的优缺点。The mixassembly circuit board, which not only include surface mount components, but also contains the throughhole components. With the electronic assembly technology development, the soldering process for the pure surface mount components circuit board or pure throughhole components circuit board has been very mature. But for mixed circuit board soldering, there are many methods, and the process is more complicated. How to choose soldering method is given for reference. Introduce variety of soldering methods for throughhole components in mixed circuit board, and discuss the advantages and disadvantages of these soldering methods.

关 键 词：混装电路板 通孔元器件 表面贴装元器件 焊接 

分 类 号：TN605[电子电信—电路与系统]